Chinese technology firms showcased AI-driven devices and computing solutions at Mobile World Congress 2026 in Barcelona, including new robotics concepts and AI-enabled smartphones.
From March 2nd to 5th, the Mobile World Congress 2026 was held in Barcelona, Spain. Under the theme “The IQ Era,” the event focused on artificial intelligence and next-generation connectivity. Chinese technology companies expanded their presence this year, with more than 350 exhibitors participating across the industry chain, HKCNA reported.
Companies including Huawei, ZTE, vivo, Alibaba, Xiaomi and HONOR introduced new devices and technical solutions covering telecommunications networks, terminal products and computing infrastructure.
Huawei and ZTE presented updated computing power solutions designed to support AI applications and large-scale deployment scenarios.
Market Pressure and Industrial Adjustment
Artificial intelligence continues to reshape the mobile sector. Industry participants at MWC discussed the integration of AI with telecom networks, Internet of Things systems and extended reality technologies.
At the same time, the global smartphone market faces slower growth. According to IDC, worldwide smartphone shipments are projected to decline 12.9 per cent in 2026 to 1.12 billion units, partly due to AI-related memory chip shortages.
IDC China Vice President Wang Jiping said at the event that some manufacturers are increasing investment in robotics and AIoT products as they diversify beyond traditional smartphones.
New Product Concepts From Chinese Brands
During the exhibition, HONOR unveiled the ROBOT PHONE, which is scheduled for release in the second half of the year.
The device incorporates a four-degree-of-freedom gimbal system that enables rotational and tilting movement. The company stated that the design supports embodied AI interaction and dynamic user engagement during video communication.
HONOR also presented a humanoid robot prototype, marking its entry into the consumer humanoid robotics segment.
Meanwhile, Transsion showcased an ultra-thin modular concept smartphone measuring 4.9 millimetres in thickness. The device allows users to attach external accessories through magnetic connectors.
IDC data released at the event showed continued expansion of AI-related devices. Global monthly active AI users have surpassed one billion. AI-enabled smartphones account for more than half of new shipments, while AI glasses recorded annual growth exceeding 50 per cent.
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